| 摘要 |
Provided is a space-saving soldering device that can perform allowing high-reliability soldering at a low cost and a high yield be produced at low cost with a high yield. For achieving the above-described objects, the soldering device includes: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode, and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component. |
| 主权项 |
1. A soldering device, comprising:
a first processor in which a component, having an electrode to be soldered, is set; a second processor that is separated in a sealable manner by a first opening-closing controller, which is provided between the first processor and the second processor, and that sends out the component, which is fed from the first processor, to the subsequent third processor; a third processor that is separated in a sealable manner by a second opening-closing controller, which is provided between the second processor and the third processor, and that causes the component, which is fed from the second processor, to make contact with an organic fatty acid-containing solution, and that moves the component horizontally; a fourth processor that has a molten solder adhesion controller that moves the component, which has been moved horizontally by the third processor, to an upper space portion and that causes the molten solder to be adhered onto the electrode and a molten solder remover that removes excessive molten solder out of the molten solder adhered in the space portion; a fifth processor that moves the component horizontally, which has been moved downward in the fourth processor; a sixth processor that is separated in a sealable manner by a third opening-closing controller, which is provided between the fifth processor and the sixth processor, and that sends out the component, which is fed from the fifth processor, to the subsequent seventh processor; and a seventh processor that is separated in a sealable manner by a fourth opening-closing controller, which is provided between the sixth processor and the seventh processor, and that takes out the component, which is fed from the sixth processor. |
