发明名称 LIGHT EMITTING APPARATUS AND IMAGE FORMING APPARATUS
摘要 A light emitting apparatus includes: a pixel circuit formed over a substrate; a partition including a plurality of openings formed over the substrate with the pixel circuit; and a plurality of pixels defined by the plurality of the openings, wherein the pixel includes a light emitting element including a lower electrode connected to the pixel circuit and an organic compound layer formed over the lower electrode, the plurality of the pixels is arranged in a line in a longitudinal direction of the substrate, the pixel circuit includes: a transistor including a gate electrode and source/drain electrodes; a first interconnection including the gate electrode; and a second interconnection including the source/drain electrodes, and the second interconnection and an interconnection formed of a same layer as the second interconnection are separated from the organic compound layer in planar view from a direction perpendicular to a main surface of the substrate.
申请公布号 US2016041493(A1) 申请公布日期 2016.02.11
申请号 US201514817559 申请日期 2015.08.04
申请人 CANON KABUSHIKI KAISHA 发明人 Goden Tatsuhito;Moriyama Takashi;Kajimoto Norifumi;Shiobara Satoru
分类号 H01L29/08 主分类号 H01L29/08
代理机构 代理人
主权项 1. A light emitting apparatus comprising: a pixel circuit formed over a long substrate; a partition formed over the substrate provided with the pixel circuit, the partition including a plurality of openings; and a plurality of pixels defined by the plurality of the openings, wherein the pixel comprises a light emitting element comprising a lower electrode connected to the pixel circuit and an organic compound layer formed over the lower electrode, the plurality of the pixels is arranged in a line in a longitudinal direction of the substrate, the pixel circuit comprises: a transistor comprising a gate electrode and source/drain electrodes; a first interconnection comprising the gate electrode; and a second interconnection comprising the source/drain electrodes, and the second interconnection and an interconnection formed of a same layer as the second interconnection are separated from the organic compound layer in planar view from a direction perpendicular to a main surface of the substrate.
地址 Tokyo JP