发明名称 Method of Analyzing at Least Two Inhibitors Simultaneously in a Plating Bath
摘要 The presently claimed invention provides an accurate, fast, and cost effective method for determining the additive concentrations of at least two inhibitors simultaneously in an electroplating bath by using different electrical load conditions. The method of the present invention is able to determine additive concentrations of different inhibitors effectively during on-line feedback control for adjusting the amount of additives in the electroplating bath to maintain the additive concentrations within pre-defined limits during device production.
申请公布号 US2016041125(A1) 申请公布日期 2016.02.11
申请号 US201414453636 申请日期 2014.08.07
申请人 Hong Kong Applied Science and Technology Research Institute Company Limited 发明人 SUN Yaofeng;GAO Minghui;XIA Hai
分类号 G01N27/48 主分类号 G01N27/48
代理机构 代理人
主权项 1. A method for determining additive concentrations of a first and a second inhibitors in a plating bath, comprising: determining a first and a second inhibition factors of the first and the second inhibitors by applying a first and a second electrical load conditions respectively on a first and a second supporting solutions; determining equivalent suppressor concentrations of a testing solution under the first and the second electrical load conditions respectively, wherein the testing solution comprises a virgin make-up solution and a portion of the plating bath, and the virgin make-up solution is an electrolyte solution comprising substances of the plating path except the first and the second inhibitors; and determining the additive concentrations of the first and the second inhibitors in the plating bath based on the first and the second inhibition factors and the equivalent suppressor concentrations of the testing solution under the first and the second electrical load conditions.
地址 Hong Kong HK