LABELED-COMPONENT SUBSTRATE MOUNTING METHOD

摘要

In a labeled-component substrate mounting method, duplication of effort of adsorbing and fitting would be required if an electronic component is mounted using a fitting nozzle and then a label is adsorbed and fitted on an upper surface of the electronic component. After the label is adsorbed by the fitting nozzle, the label is press-mounted on the upper surface of the electronic component, and the electronic component is also integrally adsorbed as is and moved to the circuit substrate for mounting. In this way, both the electric component and the label can be integrally mounted on the circuit substrate at once without requiring the duplication of effort of mounting the component and attaching the label onto the upper surface thereof, whereby the number of mounting steps can be decreased.