| 摘要 |
PROBLEM TO BE SOLVED: To improve the junction between an element and a substrate in a semiconductor device.SOLUTION: A semiconductor element includes: a first substrate; a junction layer provided on one primary surface of the first substrate; and a semiconductor packaging component including a second substrate provided on the junction layer, a wiring portion provided on the second substrate, and at least one semiconductor chip mounted on the wiring portion. The junction material of the junction layer contains material particles forming the junction layer by sintering. The material particles include particles having a size of nano-order or micron-order and spacer particles having a size that controls the thickness of the junction layer. The spacer particles include coating on their particle surfaces for reaction control. |
