发明名称 電子部品実装システム
摘要 The present invention aims to provide an electronic component mounting system which can ensure correspondence between a substrate and operation result data through a simple method in a manner that an operation result is front-fed to a back step. The electronic component mounting system is provided with the following components: a substrate standby device (M3) as a substrate standby part which is provided with a plurality of standby positions for causing standby of the substrate individually; a storing device (60) (standby substrate information storing part) which stores through correlating substrate ID (substrate identification information) of the substrate (4) that is standby at the substrate standby device (M3) with the standby position; and a substrate ID management part (46) (identification information updating part) which updates the substrate ID that is stored in the storing device (60) along with movement of the substrate (4) from a printing checking device (M2) to the substrate standby device (M3), and transmits the substrate ID that is stored in the storing device (60) and the checking result data that are correlated with the substrate ID to a component loading device (M4).
申请公布号 JP5857190(B2) 申请公布日期 2016.02.10
申请号 JP20120093619 申请日期 2012.04.17
申请人 パナソニックIPマネジメント株式会社 发明人 永井 大介
分类号 H05K13/02;H05K13/04 主分类号 H05K13/02
代理机构 代理人
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