| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that can sufficiently suppress collapse of an uneven pattern.SOLUTION: A substrate processing apparatus U1 includes a rotation holding unit 20, a developer supply unit 23, a rinse liquid supply unit 24, a filling liquid supply unit 25, and a control unit 27. The control unit 27 controls the rotation holding unit 20 and the developer supply unit 23 to supply a developer to a surface of a wafer W while rotating the wafer W, and then controls the rotation holding unit 20 and the rinse liquid supply unit 24 to supply a rinse liquid to the surface of the wafer W while rotating the wafer W to form an uneven pattern. The control unit 27 controls the rotation holding unit 20 and the filling liquid supply unit 25 to supply a filling liquid onto the uneven pattern while rotating the wafer W to replace the rinse liquid with the filling liquid, and then controls the rotation holding unit 20 to rotate the wafer W to dry the filling liquid to form a filling portion having the height lower than that of a protrusion of the uneven pattern in a recess of the uneven pattern. |
