发明名称 CONDUCTIVE FILLER OF FLAKE FORM
摘要 The present invention provides a flake-form conductive filler which is easy and low-cost to produce and has a high conductivity. The flake-form conductive filler of the present invention includes a flake-form base material and a silver coating covering the entire surface of the flake-form base material. The flake-form base material contains copper. The flake-form conductive filler has a ratio a/b between a peak intensity "a" derived from a silver (111) plane and a peak intensity "b" derived from a silver (220) plane at 2 or less in the powder X-ray diffraction measurement.
申请公布号 EP2806429(A4) 申请公布日期 2016.02.10
申请号 EP20130738932 申请日期 2013.01.10
申请人 TOYO ALUMINIUM KABUSHIKI KAISHA 发明人 KOIKE, KAZUNORI;FUJII, MIKI;MINAMIYAMA, HIDEAKI;MINAMI, KAZUYA
分类号 H01B5/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B13/00 主分类号 H01B5/00
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