发明名称 |
CONDUCTIVE FILLER OF FLAKE FORM |
摘要 |
The present invention provides a flake-form conductive filler which is easy and low-cost to produce and has a high conductivity. The flake-form conductive filler of the present invention includes a flake-form base material and a silver coating covering the entire surface of the flake-form base material. The flake-form base material contains copper. The flake-form conductive filler has a ratio a/b between a peak intensity "a" derived from a silver (111) plane and a peak intensity "b" derived from a silver (220) plane at 2 or less in the powder X-ray diffraction measurement. |
申请公布号 |
EP2806429(A4) |
申请公布日期 |
2016.02.10 |
申请号 |
EP20130738932 |
申请日期 |
2013.01.10 |
申请人 |
TOYO ALUMINIUM KABUSHIKI KAISHA |
发明人 |
KOIKE, KAZUNORI;FUJII, MIKI;MINAMIYAMA, HIDEAKI;MINAMI, KAZUYA |
分类号 |
H01B5/00;B22F1/00;B22F1/02;H01B1/00;H01B1/22;H01B13/00 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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