发明名称 |
Wavelength converted light emitting device |
摘要 |
Embodiments of the invention include a semiconductor structure including a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support. In some embodiments, a thickness of the wavelength converting material on a side of the semiconductor structure is at least 25% of a thickness of the wavelength converting material over a top of the semiconductor structure. |
申请公布号 |
US9257617(B2) |
申请公布日期 |
2016.02.09 |
申请号 |
US201314375461 |
申请日期 |
2013.02.07 |
申请人 |
Koninklijke Philips N.V. |
发明人 |
Bierhuizen Serge Joel Armand |
分类号 |
H01L27/15;H01L33/50;H01L33/56;H01L33/00;H01L33/36 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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主权项 |
1. A device comprising:
a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region; a metal n-contact disposed on the n-type region and a metal p-contact disposed on p-type region; a support, wherein the semiconductor structure is attached to the support through at least one of the n-contact and the p-contact such that the semiconductor structure and the support are mechanically self-supporting; and a wavelength converting material extending over the sides of the semiconductor structure and the support; wherein the wavelength converting material is a phosphor powder mixed with a transparent binder material in a pre-fabricated sheet. |
地址 |
Eindhoven NL |