Semiconductor package having heat slug and passive device

摘要

Provided is a semiconductor package including a substrate, a semiconductor chip and a passive device disposed on the substrate, and a heat slug configured to cover the semiconductor chip and the passive device. The substrate and a first electrode of the passive device are electrically connected to each other, and the heat slug and a second electrode of the passive device are electrically connected to each other. The semiconductor package may include multiple passive devices in which a vertical height of each passive device is greater than a horizontal width thereof. Also disclosed is an electronic system, which may include a power supply unit, a microprocessor unit, a function unit, and a display controller unit to receive one or more power supply voltages from the power supply unit. At least one of the microprocessor unit, the function unit, or the display controller unit may further include the described semiconductor package.

主权项

1. A semiconductor package comprising:
a substrate; a first power supply voltage electrode, a second power supply voltage electrode, and a ground voltage electrode, which are disposed on the substrate; a semiconductor chip, a first passive device, and a second passive device, which are disposed on the substrate; a heat slug covering the semiconductor chip, the first passive device, and the second passive device, wherein the heat slug is electrically connected to the ground voltage electrode; a first electrode of the first passive device electrically connected to the first power supply voltage electrode; a second electrode of the first passive device electrically connected to the heat slug; a first electrode of the second passive device electrically connected to the second power supply voltage; and a second electrode of the second passive device electrically connected to the heat slug.