Semiconductor package, and interposer structure of the semiconductor package

摘要

A method of fabricating a semiconductor package is provided, including: cutting a substrate into a plurality of interposers; disposing the interposers in a plurality of openings of a carrier, wherein the openings are spaced from one another by a distance; forming a first encapsulant to encapsulate the interposers; removing the carrier; and disposing at least a semiconductor element on each of the interposers. By cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers.

主权项

1. A semiconductor package, comprising:
a first encapsulant; an interposer embedded in the first encapsulant, wherein the interposer has opposite first and second surfaces, side surfaces connected to the opposite first and second surfaces, and a plurality of conductive through holes penetrating the first and second surfaces, each of the conductive through holes having a first end at the first surface and a second end opposite to the first end, the second surface of the interposer arranged to dispose a packaging substrate thereon, and the side surfaces of the interposer being covered by the first encapsulant; at least a semiconductor element disposed on and electrically connected to the first surface of the interposer; and a second encapsulant formed on the first encapsulant to encapsulate the semiconductor element.