| 发明名称 | Lead-free solder and electronic component built-in module | ||
| 摘要 | A first solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. An electronic component built-in module may include an electronic component and a substrate on which the electronic component is installed, where a terminal of the electronic component and a terminal of the substrate are joined together by using the lead-free solder. | ||
| 申请公布号 | US9258905(B2) | 申请公布日期 | 2016.02.09 |
| 申请号 | US201113005838 | 申请日期 | 2011.01.13 |
| 申请人 | TDK CORPORATION | 发明人 | Yasui Tsutomu;Abe Hisayuki;Kawabata Kenichi;Kitamura Tomoko |
| 分类号 | H01R9/00;H05K3/34;B23K35/02;B23K35/26;B23K35/30 | 主分类号 | H01R9/00 |
| 代理机构 | Oliff PLC | 代理人 | Oliff PLC |
| 主权项 | 1. An electronic component built-in module that includes an electronic component and a substrate on which the electronic component is installed, wherein a terminal of the electronic component and a terminal of the substrate are joined together by using lead-free solder, and the lead-free solder includes: a first metal that contains at least Sn;a second metal that contains at least a Ni—Fe alloy and contains no greater than 16% of Fe by mass; anda paste material, wherein the first metal and the second metal are in the form of separated particles and are dispersed in the paste material, wherein a ratio of the second metal to a total mass of the lead-free solder is in a range from 5% by mass to 30% by mass inclusive. | ||
| 地址 | Tokyo JP | ||