发明名称 Side pad design for edge pedestal
摘要 A method and apparatus for facilitating equalized conditioning of a polishing surface of a polishing pad is described. The apparatus includes an extension device coupled to a base adjacent a peripheral edge of a polishing pad that is adapted to support a conditioning device, the extension device includes a body that is movable relative to the polishing pad, and a sacrificial pad comprising a polishing material coupled to a mounting surface of the body.
申请公布号 US9254547(B2) 申请公布日期 2016.02.09
申请号 US201012751743 申请日期 2010.03.31
申请人 APPLIED MATERIALS, INC. 发明人 Yuan Yin;Chen Hung Chih;Chang Shou-Sung
分类号 B24B53/017;B24B37/005;B24B37/10;B24B37/34 主分类号 B24B53/017
代理机构 Patterson & Sheridan, LLP 代理人 Patterson & Sheridan, LLP
主权项 1. An apparatus, comprising: a base having a rotatable polishing pad coupled to an upper surface thereof, the polishing pad having a polishing surface and a peripheral edge; a carrier head adapted to retain a substrate; a conditioning device adapted to move relative to the polishing surface in a sweep pattern that extends beyond the peripheral edge; and an extension device coupled to the base adjacent the peripheral edge of the polishing pad and adapted to support the conditioning device when the conditioning device in at least a portion of the sweep pattern, the extension device comprising: a body that is movable relative to the polishing pad; anda sacrificial pad comprising a polishing material coupled to a mounting surface of the body, wherein one or both of the body and sacrificial pad includes an indexing feature.
地址 Santa Clara CA US