发明名称 Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
摘要 The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess.
申请公布号 US9257417(B2) 申请公布日期 2016.02.09
申请号 US201314141429 申请日期 2013.12.27
申请人 NICHIA CORPORATION 发明人 Nakabayashi Takuya;Hashimoto Toshiyuki
分类号 H01L23/495;H01L25/13;H01L25/075;H01L33/62;H01L25/16;H01L33/48;H01L33/64;F21Y101/02;F21Y103/00;F21Y105/00 主分类号 H01L23/495
代理机构 Mori & Ward, LLP 代理人 Mori & Ward, LLP
主权项 1. A light emitting device comprising: a light emitting element; and a light emitting device package having a longitudinal direction as viewed from above and a transverse direction perpendicular to the longitudinal direction, the light emitting device package comprising: a first and second lead-frame lined-up in the longitudinal direction; andmolded resin holds the first and second lead-frames integrally, wherein the first lead-frame comprises: a main body; andan extension from the main body that extends with a narrowed width towards the second lead-frame, wherein a recess is established in the bottom surface of the first lead-frame, wherein at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess, and wherein the light emitting element is mounted on each upper surface of the first and second lead-frames.
地址 Anan-shi JP