| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging device having a wiring pattern 50 which is laid by an ink jet method and enables high density connection between a wiring plate 30 and an imaging element 20 having an external electrode 22 provided on a slope surface 20SS.SOLUTION: An imaging device 1 has an imaging element 20 having plural external electrodes 22 arranged on a slope surface 20SS, a wiring plate 30 having plural connection electrodes 32 arranged on the principal surface 30SA, plural relay members 40 formed of a gourd-shaped conduction material having two convex portions disposed at the boundary BL between the slope surface 20SS of the imaging element and the principal surface 30SA of the wiring plate 30, and plural wiring patterns 50 which are connected to the relay members 40 and provided by an ink jet method.SELECTED DRAWING: Figure 3 |
