发明名称 POWER-SUPPLY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power-supply device capable of effectively achieving downsizing.SOLUTION: A power-supply device includes: an electronic component group 20 including a transformer 2a having a primary winding 21 and a secondary winding 22, a primary side semiconductor component 2b connected to the primary winding 21, a secondary side semiconductor component 2c connected to the secondary wiring 22, and a choke coil 22d connected to the secondary side semiconductor component 2c; two insulating substrates 3; and a base plate 4. The two insulating substrates 3a and 3b and the base plate 4 are arranged so as to overlap each other in a thickness direction of the base plate 4. On the insulating substrate 3, a metal pattern portion 5 is formed by processing a metal layer to a predetermined pattern. A part of the metal pattern portion 5 constitutes a wiring 50. Each of the electronic components 2 are electrically connected to each other by the wiring 50. At least two electronic components 2 among the four electronic components 2 are structured so as to overlap each other in the thickness direction.SELECTED DRAWING: Figure 1
申请公布号 JP2016025705(A) 申请公布日期 2016.02.08
申请号 JP20140147272 申请日期 2014.07.18
申请人 DENSO CORP 发明人 ISHIKAWA MASAMICHI
分类号 H02M3/28 主分类号 H02M3/28
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