ELECTRONIC COMPONENT COMPRISING A SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING SAID COMPONENT

摘要

The invention relates to an electronic component (1), in particular a high-frequency power module. Said component comprises a housing (3) containing a hollow chamber surrounded by a housing frame (40) with plastic walls (5). At the base of the plastic walls (5), a metal frame (6) is connected to said walls (5) in a positive fit by means of anchor elements (14), in such a way that a housing base (9) is attached to the housing frame (40) in a temperature-resistant manner using a soldered joint (15).