METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, SEMICONDUCTOR POWER MODULE, VEHICLE HAVING SEMICONDUCTOR MODULE, AND RAILWAY VEHICLE HAVING SEMICONDUCTOR MODULE

摘要

PROBLEM TO BE SOLVED: To suppress a semiconductor chip in a semiconductor module from being cracked.SOLUTION: A semiconductor module 50 includes: a semiconductor chip 1 which has a lower surface 1a and an upper surface 1b; a support electrode part 5 which is joined to the lower surface 1a of the semiconductor chip 1 via a Zn-Al-based joint part 4; a lead 2 which is joined to the upper surface 1b of the semiconductor chip 1 via a conductive joint part 3 consisting of a joint material different from a main material of the Zn-A1-based joint part 4; and a hard resin (resin sealing part) 6 which seals the semiconductor chip 1, joint parts on both upper and lower surfaces, and a part of the lead 2.SELECTED DRAWING: Figure 1