| 摘要 |
PROBLEM TO BE SOLVED: To thin a printed wiring board, to suppress warpage thereof even when there is a difference in a coefficient of thermal expansion between an electronic component incorporated in a resin insulating layer and the resin insulating layer and to flatten the surfaces of the resin insulating layer and of an embedded wiring layer.SOLUTION: A resin insulating layer 11 having a core material is formed. A first wiring layer 12 is formed to be embedded in the resin insulating layer 11 in such a way that one surface is exposed on a first surface 11a of the resin insulating layer 11. A second wiring layer 14 is formed in a projected manner on a surface of a second surface 11b of the resin insulating layer 11. An electronic component 20 having electrodes 21 and 22 is embedded in the resin insulating layer 11 at least on the second surface 11b side thereof. A first via conductor 15b is formed from the second surface 11b side of the resin insulating layer 11 so as to electrically connect between: the electrodes 21 and 22 of the electronic component 20; and the second wiring layer 14. In addition, the first wiring layer 12 and the second wiring layer 14 are formed so as to be electrically connected by a second via conductor 15b from the second surface 11b side of the resin insulating layer 11.SELECTED DRAWING: Figure 1 |
