| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin film-provided prepreg having a low water absorption rate and being excellent in heat resistance, and to provide a metal-clad laminate and a printed wiring board.SOLUTION: A resin film-provided prepreg consists of a prepreg formed by impregnating glass cloth with a resin composition containing a polyimide resin as a thermosetting resin and drying and a resin film containing fluorine atoms on one or both sides of the prepreg. The resin composition contains an epoxy resin further as a thermosetting resin. The resin film containing fluorine atoms is composed of a tetrafluoroethylene-hexafluoropropylene copolymer (FEP) or a fluoroethylene-vinyl ether alternate copolymer.SELECTED DRAWING: None |
