| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a laminate including a cured resin layer which is excellent in heat resistance (for example, solder heat resistance) and a wiring burying property and in which generation of faults such as wrinkles and voids can be prevented effectively.SOLUTION: A method for producing a laminate comprises: a first step of forming a curable resin composition layer, which comprises a thermocurable resin composition having the minimum melt viscosity of 1-400 Pa-s at 80-150°C, on a support having the thickness of 40-80 μm so that the thickness thereof is made thinner than that of the support and is 3-60 μm to obtain the curable resin composition layer stuck to the support; a second step of piling the curable resin composition layer stuck to the support on a base material so that the curable resin composition layer-formed surface side is piled thereon to obtain a combined body consisting of the base material and the curable resin composition layer stuck to the support; a third step of heating the combined body so that the curable resin composition layer is cured thermally to obtain the cured resin layer; and a fourth step of peeling the support from the cured resin layer.SELECTED DRAWING: None |
