| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier for a semiconductor process which prevents a small substrate such as a sapphire substrate from being dropped even in a vertical direction or an inverse direction by sucking and fixing the small substrate on an adapter plate for cancelling a difference of dimensions when performing a process of the small substrate while using a semiconductor manufacturing device corresponding to a large-diameter silicon substrate.SOLUTION: In order to make a sapphire substrate 4 adaptive to the semiconductor manufacturing device corresponding to the large-diameter silicon substrate, an opening 10 is applied onto a carriage base part 1 formed from the large-diameter silicon substrate by punching, and a polyimide film 2 is bonded and stuck on a rear side, thereby configuring the carrier for the semiconductor process. Vacuum chucking and electrostatic chucking can be performed on the sapphire substrate 4 by the carrier for the semiconductor process, and the sapphire substrate 4 can be attached to and detached from the opening 10 on the carriage base part 1 outside of the semiconductor manufacturing device, and the semiconductor manufacturing device is adapted to carriage or the process without alteration or the like.SELECTED DRAWING: Figure 1 |
