| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits concentration of thermal strain occurring at a solder to achieve high reliability; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 10 comprises: semiconductor elements; an insulating substrate 20 having a circuit board 22, an insulating board 21 and a metal board 23 each of which has a rectangular shape in plan view and which are laminated and in which the semiconductor elements are fastened to the circuit board 22 and which has at least one first groove 23a provided at each of four corners of the metal plate 23; a metallic heat dissipation member 30 on which the insulating substrate 20 is arranged in a predetermined arrangement region and which has at least one second groove 30a at each of four corners of the arrangement region; positioning members 50 which are arranged between the four corners of the metal board 23 and the four corners of the heat dissipation member 30 and each of which is fitted into the first groove 23a and the second groove 30a; and a solder 42 which filled in between the insulating substrate 23 and the heat dissipation member 30 and covers the positioning members 50.SELECTED DRAWING: Figure 8 |
