发明名称 FREQUENCY MULTIPLIER BASED ON A LOW DIMENSIONAL SEMICONDUCTOR STRUCTURE
摘要 A frequency multiplier based on a low dimensional semiconductor structure, including an insulating substrate layer, a semiconductor conducting layer arranged on the surface of the insulating substrate layer, an insulating protective layer arranged on the surface of the semiconductor conducting layer, an insulating carving groove penetrating the semiconductor conducting layer, an inlet electrode arranged on the side surface of the semiconductor conducting layer, and an outlet electrode arranged on the side surface corresponding to the access electrode is provided. The semiconductor conducting layer comprises two two-dimensional, quasi-one-dimensional, or one-dimensional current carrying channels near to and parallel to each other. The frequency multiplier has advantages that the structure is simple, the process is easy to implement, no extra filter circuit needs to be added, dependence on material characteristics is little, and the selection range of materials is wide.
申请公布号 US2016035837(A1) 申请公布日期 2016.02.04
申请号 US201414767301 申请日期 2014.03.25
申请人 SOUTH CHINA NORMAL UNIVERSITY 发明人 Xu Kunyuan
分类号 H01L29/20;H03B19/14 主分类号 H01L29/20
代理机构 代理人
主权项 1. A frequency multiplier based on a low dimensional semiconductor structure, comprising an insulating substrate layer, a semiconductor conducting layer arranged on the surface of the insulating substrate layer, an insulating conducting layer arranged on the surface of the semiconductor conducting layer, an insulating carving groove penetrating the semiconductor conducting layer, an inlet electrode arranged on a side surface of the semiconductor conducting layer and an outlet electrode arranged on the other side surface corresponding to the inlet electrode, wherein the semiconductor conducting layer comprises two two-dimensional, quasi-one-dimensional, or one-dimensional current carrying channels close and parallel to each other.
地址 Guangzhou, Guangdong CN