CHIP ATTACHMENT SYSTEM

摘要

Forming the chip attachment system includes obtaining a chip having a bump core on a die. The method also includes obtaining an intermediate structure having a transfer pad on a substrate. The method further includes transferring the transfer pad from the substrate to the bump core such that the transfer pad becomes a solder layer on the bump core.

主权项

1. A flip chip system, comprising:
a contact pad on a die; a chip bump on the contact pad, the chip bump including a solder layer on a bump core.