APPARATUS AND METHODS FOR TREATING SUBSTRATES

摘要

The present invention relates to an apparatus and a method for treating a substrate. The apparatus for treating a substrate includes a spin chuck which supports a substrate; a first nozzle which is movable on a surface of the substrate, and provides liquid drops of a process solution on the surface of the substrate; a nozzle arm which moves the first nozzle on the surface of the substrate; and a second nozzle which provides a wetting solution onto the surface of the substrate and forms a wetting layer. The second nozzle is vertically moved with the first nozzle. The thickness of the wetting layer is changed as the second nozzle vertically moves.