CERAMIC CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

摘要

[Problem] To obtain a ceramic circuit substrate that has excellent cracking resistance against ultrasonic bonding. [Solution] The problem is solved by means of a ceramic circuit substrate having a metal circuit board bonded to one surface of a ceramic substrate and a metal heat dissipation plate bonded to the other surface, wherein said ceramic circuit substrate is characterized by the metal circuit board having a crystal particle size of 20-70 μm. This ceramic circuit substrate can be produced by respectively disposing the metal circuit board on one surface of the ceramic substrate and the metal heat dissipation plate on the other surface, and bonding at a degree of vacuum of 1×10-3 Pa or less, at a bonding temperature of 780-850°C, and for a retention time of 10-60 minutes.