发明名称 MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE
摘要 A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.
申请公布号 US2016037622(A1) 申请公布日期 2016.02.04
申请号 US201514879296 申请日期 2015.10.09
申请人 Murata Manufacturing Co., Ltd. 发明人 SHINAGAWA Hirofumi;TAGO Shigeru
分类号 H05K1/02;H05K1/11;H05K3/46;H05K1/03 主分类号 H05K1/02
代理机构 代理人
主权项 1. A multilayer resin substrate comprising: a plurality of resin substrates that are laminated together; an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the plurality of resin substrates; and a non-overlapping portion in which the signal line and the other conductor pattern do not overlap each other in the laminating direction of the plurality of resin substrates; wherein a thin portion is provided at a position in the non-overlapping portion near the overlapping portion, the thin portion being a portion of the multilayer resin substrate which has a thickness smaller than a thickness in the overlapping portion in the laminating direction of the resin substrates.
地址 Nagaokakyo-shi JP