发明名称 |
MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE |
摘要 |
A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates. |
申请公布号 |
US2016037622(A1) |
申请公布日期 |
2016.02.04 |
申请号 |
US201514879296 |
申请日期 |
2015.10.09 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
SHINAGAWA Hirofumi;TAGO Shigeru |
分类号 |
H05K1/02;H05K1/11;H05K3/46;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A multilayer resin substrate comprising:
a plurality of resin substrates that are laminated together; an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the plurality of resin substrates; and a non-overlapping portion in which the signal line and the other conductor pattern do not overlap each other in the laminating direction of the plurality of resin substrates; wherein a thin portion is provided at a position in the non-overlapping portion near the overlapping portion, the thin portion being a portion of the multilayer resin substrate which has a thickness smaller than a thickness in the overlapping portion in the laminating direction of the resin substrates. |
地址 |
Nagaokakyo-shi JP |