METHOD FOR PRODUCING SEMICONDUCTOR LIGHT-EMITTING DEVICE

摘要

Provided is a method for producing a semiconductor light-emitting device comprising a step for applying a silicone resin composition to the surface of a semiconductor light-emitting element and a step for forming a sealing part that covers the surface of the semiconductor light-emitting element by thermosetting the applied silicone resin composition. The silicone resin composition contains, in terms of the total mass of the silicone resin composition solid content, 60 mass% or more of a silicone resin the structural component silicon atoms of which are substantially only silicon atoms bonded with three oxygen atoms. The thermosetting is performed under conditions satisfying 5 < a - b < 20 when a cm-1 is the position of the IR absorption spectrum peak derived from Si-O-Si bonds at 1000 to 1050 cm-1 of the silicone resin before thermosetting, and b cm-1 is the position of the IR absorption spectrum peak derived from Si-O-Si bonds at 950 to 1050 cm-1 of the silicon resin composition after thermosetting.