APPARATUS, SYSTEMS AND METHODS FOR LIMITING TRAVEL DISTANCE OF A HEAT SINK

摘要

A heat sink embodiment has at least one anti-rocking tab that extends outwardly and downwardly from an edge of the body portion of the heat sink. A leading lower edge of the anti-rocking tab is above a top surface of the motherboard when the heat sink is being affixed to the motherboard over a flip chip. During installation of the heat sink to the motherboard, a travel distance limit is imposed by the leading lower edge of the anti-rocking tab, thereby limiting a force that is applied to the die of the flip chip so that an edge and/or a corner of the die of the flip chip is not crushed, or such that the die of the flip chip is not cracked.

主权项

1. A heat sink configured to conduct heat away from a die of a flip chip residing on a motherboard, comprising:
a body portion defined by a bottom surface and a top surface,
wherein the body portion has a first bore and a second bore,wherein the first bore and the second bore extend through the body portion,wherein the first bore and the second bore are configured to receive a fastener that affixes the heat sink to the motherboard, andwherein the body portion is in thermal contact with a top portion of the die of the flip chip when the body portion is affixed to the motherboard; and an anti-rocking tab extending outwardly and downwardly from an edge of the body portion,
wherein the anti-rocking tab is defined by a leading lower edge that extends downward below the bottom surface of the body portion by a first distance (D1), wherein the leading lower edge of the anti-rocking tab is above a top surface of the motherboard by a second distance (D2) when the body portion is affixed to the motherboard.