HEAT-DISSIPATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING HEAT-DISSIPATING CIRCUIT BOARD

摘要

In the present invention, a heat-dissipating circuit board is provided with: a printed wiring board that has an insulating film and a conductive pattern that is laminated on the surface side of the insulating film and includes one or more land portions and wiring portions connected to the land portions; and one or more electronic components mounted on the surface side of the one or more land portions. The heat-dissipating circuit board is also provided with a heat-conductive adhesive layer filled in a recess that extends to the conductive pattern and that is provided on at least a portion of the projection region of the land portions on the opposite side from the electronic component mounting side. In addition, on the heat-dissipating circuit board, the insulating film remains on a region that includes, in plan view, the connecting edges where the land portions connect to the wiring portions, or at least a part of the peripheral edges opposing the connecting edges.