| 发明名称 |
PRESSURE SENSING IMPLANT |
| 摘要 |
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing. |
| 申请公布号 |
US2016029956(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201414777654 |
申请日期 |
2014.03.17 |
| 申请人 |
ENDOTRONIX, INC. |
发明人 |
ROWLAND Harry;NAGY Michael;WATKINS Roger;SUNDARAM Balamurugan;SUNDARAM Suresh |
| 分类号 |
A61B5/00;A61B5/07;A61B5/0215 |
主分类号 |
A61B5/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit comprising:
a housing having a plurality of walls and at least one opening; a sensor connected to an opening in said housing, said sensor comprising:
a first layer having a first dimension;a second layer having a second dimension shorter than said first dimension; and wherein said second layer is positioned entirely within said housing and a surface of said first layer is exposed to an exterior of said housing. |
| 地址 |
Woodridge IL US |
