| 摘要 |
An electronic apparatus (100) is provided with a housing (40), a circuit board (P), and a heat conductive sheet (101). The circuit board (P) is attached to the inside of the housing (40). On the circuit board (P), electronic components (50, 51, 52, 53) are mounted, and metallic cases (61, 62) are attached. The heat conductive sheet (101) has first flat surface portions (110, 111, 112), a second flat surface portion (120), and connecting portions (130, 131, 132). The heat conductive sheet (101) is deformed such that the first flat surface portions (110, 111, 112) protrude further toward the circuit board (P) side than the second flat surface portion (120). The first flat surface portion (110, 111, 112) surfaces on the circuit board (P) side are bonded to the electronic component (51) and the metallic cases (61, 62). Furthermore, the second flat surface portion (120) surface on the reverse side of the circuit board (P) is bonded to the inner surface of the housing (40). |
