ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM AND THE SEMICONDUCTOR DEVICE USING THEREOF

摘要

The present invention relates to an adhesive composition, comprising a cationic polymeric catalyst in chemical formula 1, and a compound in chemical formula 2 or chemical formula 3, to an anisotropic conductive film, and to a semiconductor device connected therethrough. Provided in the present invention are: an anisotropic conductive film, capable of being rapidly cured at low temperatures when heating and compressing, having sufficient stability, and exhibiting excellent connection properties after bonding; and a semiconductor device using the same. According to embodiments of the present invention, the anisotropic conductive film is capable of rapidly curing at low temperatures by using a cationic polymeric catalyst in chemical formula 1, and improving the stability by comprising a compound in chemical formula 2 or chemical formula 3.