| 摘要 |
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time. |
| 主权项 |
1. A curable composition, comprising:
(A) a first crosslinked polyorganosiloxane having an aliphatic unsaturated bond and a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or less; (B) a second crosslinked polyorganosiloxane having an aliphatic unsaturated bond and a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or more, which is different from that of the polyorganosiloxane (A); and (C) a polyorganosiloxane including a hydrogen atom and an aryl group bonding to a silicon atom, having a molar ratio of an aryl (Ar) group to a silicon (Si) atom of 0.3 or more, and having 3 to 10 silicon atoms, wherein the first crosslinked polyorganosiloxane (A) has an average empirical formula of Formula 1:
(R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d(OR)e [Formula 1] where R1 to R3 are each independently a monovalent hydrocarbon group, at least one of R1 to R3 is an alkenyl group, R is a monovalent hydrocarbon group, a, b, c, d, and e are each independently 0 or a positive number, d/(c+d) is 0.3 or more, and e/(c+d) is 0.2 or less. |
