Semiconductor structure and manufacturing method for the same

摘要

A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a conductive layer, a conductive architecture and a dielectric layer. The conductive layer defines adjacent first openings. The conductive architecture surrounds a portion of the conductive layer between the first openings. The dielectric layer separates the conductive layer and the conductive architecture.

主权项

1. A semiconductor structure, comprising:
a conductive layer defining adjacent first openings; a conductive architecture surrounding a portion of the conductive layer between the first openings, wherein the conductive architecture comprises: first conductive portions filling the first openings of the conductive layer; and a second conductive portion connecting the first conductive portions, and disposed on or under the conductive layer; and a dielectric layer separating the conductive layer and the conductive architecture.