发明名称 Semiconductor device and metering apparatus
摘要 A semiconductor device. The semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to a oscillation frequency of the oscillation circuit, and a frequency correction section that corrects a frequency of the timing signal based on temperature data; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip, wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.
申请公布号 US9252779(B2) 申请公布日期 2016.02.02
申请号 US201314025721 申请日期 2013.09.12
申请人 LAPIS SEMICONDUCTOR CO., LTD. 发明人 Iwasa Yosuke
分类号 H03L1/02;H03B5/04 主分类号 H03L1/02
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A semiconductor device comprising: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that generates a timing signal of a frequency according to an oscillation frequency of the oscillation circuit, a measurement counter that receives an output signal of the oscillation circuit and counts the output signal, a reference counter that receives a reference signal and counts the reference signal, and a frequency correction section that connects the measurement counter and the reference counter and that corrects a frequency of the timing signal based on temperature data and a comparison result that is obtained by comparing a count value of the measurement counter within a predetermined period and a count value of the reference counter within the predetermined period; and a discrete device that includes at least one of a temperature sensing device that detects a peripheral temperature, that supplies the detected temperature as temperature data to the frequency correction section, and that is provided as a separate body to the semiconductor chip, or a capacitor that is electrically connected to both the oscillator and the oscillation circuit and that is provided as a separate body to the semiconductor chip; wherein the oscillator, the semiconductor chip and the discrete device are contained within a single package.
地址 Yokohama JP