| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing an exposure mask capable of inexpensively producing an exposure mask by a simple process compared with the conventional method.SOLUTION: Provided is a method for producing an exposure mask for wafer working, comprising: a preparation step where a light shielding plate (25) in which the surface of a planar member (21) having a size more than that of the wafer (11) to be worked and transmitting light is covered with a light shielding film (23) shielding light is prepared; a groove formation step where a groove (27) freed from the light shielding film and also having a depth not reaching the back face of the light shielding plate is formed on the region at the surface side of the light shielding plate corresponding to the street (17) of the wafer; and a resin burying step where a transparent resin (31) is buried in the groove, and ruggedness formed at the bottom part (27a) of the groove in the groove formation step is buried.SELECTED DRAWING: Figure 3 |
