| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method for a wafer, whereby a wafer on which micro-machine devices are formed can be properly processed at low costs.SOLUTION: A processing method for wafer comprises: a resist-film covering step in which the rear face (11b) side of a wafer (11) corresponding to fixing parts (19b) for micro-machine devices (19) is covered with a resist film (21), and the rear face side of the ware corresponding to movable parts (19a) is exposed, and, additionally, the rear face side of the wafer corresponding to a dividing line (17) is intermittently covered with a resist film (23) thereby alternately providing, along the dividing line, a covered area (B), which is covered with the resist film, and an exposed area (C), which is shorter than one edge of each micro-machine device; an etching step in which plasma etching is carried out from the rear face side of the wafer; and a dividing step in which the wafer is divided along the dividing line by exerting external force to the wafer.SELECTED DRAWING: Figure 2 |
