| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element package which enables improvement of adhesion between a lead frame and a resin part.SOLUTION: A light emitting element package according to an embodiment includes: a lead frame including a first frame and second frames disposed at both sides of the first frame; a light emitting element disposed on the first frame and electrically connected with the second frame; and a resin part including a first resin part disposed between the first frame and the second frame and a second resin part covering an outer side surface of the lead frame. One end of the first frame and one end of the second frame are disposed on an outer side surface of the second resin part.SELECTED DRAWING: Figure 1 |
