CONDUCTIVE PATTERN FORMATION METHOD, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a conductive pattern formation method capable of suppressing an abnormal shape caused by reattachment of a neodymium component.SOLUTION: The conductive pattern formation method includes steps of: forming an aluminum-neodymium alloy film on a substrate; forming a conductive film having thickness of equal to or greater than 1/4 of a thickness of the aluminum-neodymium alloy film on the aluminum-neodymium alloy film; and patterning the aluminum-neodymium alloy film and the conductive film by using dry etching.SELECTED DRAWING: Figure 4