发明名称 CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive material which allows conductive particles to be efficiently arranged on electrodes when used for electrical connection between the electrodes, and a connection structure.SOLUTION: A conductive material according to the present invention comprises a polymer having a bisphenol skeleton and also having a polyether skeleton or a C3-C10 aliphatic skeleton, with its weight average molecular weight of 8000 or more, an epoxy compound with its molecular weight of 500 or less, a thermosetting agent, a flux, and conductive particles 1, the conductive particles 1 having solder on their conductive surfaces.
申请公布号 JP2016014115(A) 申请公布日期 2016.01.28
申请号 JP20140137728 申请日期 2014.07.03
申请人 SEKISUI CHEM CO LTD 发明人 KUBOTA TAKASHI
分类号 C08L63/00;C08G59/20;C09J9/02;C09J163/00;C09J171/00;H01B1/00;H01B1/22;H01B5/16;H01R11/01 主分类号 C08L63/00
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