PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

摘要

The present invention has an object to provide a pattern forming method, in which even when a pattern which is fine and has a high aspect ratio is formed, the collapse or peeling of the pattern is inhibited; a method for manufacturing an electronic device, including the pattern forming method; and an electronic device manufactured by the manufacturing method. The pattern forming method of the present invention includes an adhesion aiding layer forming step of forming an adhesion aiding layer containing a polymerizable group and having a light transmittance of 80% or more at a wavelength of 193 nm on a substrate; a resist film forming step of applying a radiation-sensitive resin composition onto the adhesion aiding layer to form a resist film; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film to form a pattern.

主权项

1. A pattern forming method comprising:
an adhesion aiding layer forming step of forming an adhesion aiding layer containing a polymerizable group and having a light transmittance of 80% or more at a wavelength of 193 nm on a substrate; a resist film forming step of applying a radiation-sensitive resin composition onto the adhesion aiding layer to form a resist film; an exposing step of exposing the resist film; and a developing step of developing the exposed resist film to form a pattern.