RESIN COMPOSITION FOR FORMING CURED FILM, CURED FILM, ELECTRICALLY CONDUCTIVE MEMBER, AND METHOD FOR PREVENTING MIGRATION

摘要

Provided is a resin composition for forming a cured film, said resin composition comprising: (A) a (meth)acrylate polymer having a weight average molecular weight of 5,000 to 200,000 (excluding a (meth)acrylate polymer having a silane structure in a side chain thereof); (B) an agent capable of preventing migration and also capable of trapping ions, which comprises a benzotriazole compound; and (C) a solvent.