| 发明名称 |
HIGH-RESOLUTION ELECTRIC FIELD SENSOR IN COVER GLASS |
| 摘要 |
A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer including at least one through-glass via, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the at least one through-glass via; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the at least one through-glass via; and a protective cover layer disposed on the receive layer. |
| 申请公布号 |
US2016026842(A1) |
申请公布日期 |
2016.01.28 |
| 申请号 |
US201414496073 |
申请日期 |
2014.09.25 |
| 申请人 |
Qualcomm Technologies, Inc. |
发明人 |
Withers Richard S.;Koo Ronald B.;Gerber Stephen C.;Samoilov Arkadii V.;Johnson David |
| 分类号 |
G06K9/00;G01R27/26 |
主分类号 |
G06K9/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A fingerprint sensor assembly, comprising:
a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer including at least one through-glass via, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the at least one through-glass via; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the at least one through-glass via; and a protective cover layer disposed on the receive layer. |
| 地址 |
San Diego CA US |
