A SPUTTERING METHOD FOR EMI SHIELDING OF THE SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a sputtering method of a semiconductor package for shielding electromagnetic interference, comprising: a film adhesion surface forming step of forming an adhesion surface on the upper surface of a film by removing a rear surface paper attached to the film; a thermal deformation and absorption member layer forming step of forming a thermal deformation and absorption member layer on the adhesion surface of the film; an adhesive support part manufacturing step of manufacturing an adhesive support part which has an adhesive layer formed on the thermal deformation and absorption member layer, by applying adhesive to the thermal deformation and absorption member layer attached to the film; an adhesive support part attaching and arranging step of forming an adhesive layer inside a ring frame by attaching the adhesive layer of the adhesive support part to the lower surface of the ring frame in a hollow shape; a semiconductor package arranging step of attaching and arranging semiconductor packages by mounting the semiconductor packages on the adhesive layer of the adhesive support part attached to the ring frame at regular intervals; and a semiconductor package sputtering step of coating five surfaces of the semiconductor packages except for lower surfaces by changing the viscosity of the thermal deformation and absorption member layer via the heating and pressurization of the adhesive support part having the semiconductor packages attached and arranged thereon using a sputtering device to conduct the sputtering of the semiconductor packages while simultaneously allowing the whole lower surfaces of the semiconductor packages to be closely bonded to the adhesive layer regardless of the shape of the semiconductor packages.