LOW TEMPERATURE HIGH RELIABILITY ALLOY FOR SOLDER HIERARCHY

摘要

A lead-free, antimony-free solder alloy comprising: (a) from 1 to 4 wt.% silver (b) from 0.5 to 6 wt.% bismuth (c) from 3.55 to 15 wt.% indium (d) 3 wt.% or less of copper (e) optionally one or more of the following elements 0 to 1 wt.% nickel 0 to 1 wt.% of titanium 0 to 1 wt.% manganese 0 to 1 wt.% of rare earths, such as cerium 0 to 1 wt.% of chromium 0 to 1 wt.% germanium 0 to 1 wt.% of gallium 0 to 1 wt.% of cobalt 0 to 1 wt.% of iron 0 to 1 wt.% of aluminum 0 to 1 wt.% of phosphorus 0 to 1 wt.% of gold 0 to 1 wt.% of tellurium 0 to 1 wt.% of selenium 0 to 1 wt.% of calcium 0 to 1 wt.% of vanadium 0 to 1 wt.% of molybdenum 0 to 1 wt.% of platinum 0 to 1 wt.% of magnesium (f) the balance tin, together with any unavoidable impurities.