发明名称 SENSOR DEVICE PACKAGING AND METHOD
摘要 <p>A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.</p>
申请公布号 EP2316008(A4) 申请公布日期 2016.01.27
申请号 EP20090808902 申请日期 2009.08.21
申请人 S3C, INC. 发明人 DANGTRAN, JOHN;HORTON, ROGER
分类号 G01L9/06;B81B7/00 主分类号 G01L9/06
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