发明名称 |
SENSOR DEVICE PACKAGING AND METHOD |
摘要 |
<p>A sensor device and a method of forming comprises a die pad receives a sensor device, such as a MEMS device. The MEMS device has a first coefficient of thermal expansion (CTE). The die pad is made of a material having a second CTE compliant with the first CTE. The die pad includes a base and a support structure with a CTE compliant with the first and second CTE. The die pad has a support structure that protrudes from a base. The support structure has a height and wall thickness which minimize forces felt by the die pad and MEMS device when the base undergoes thermal expansion or contraction forces from a header.</p> |
申请公布号 |
EP2316008(A4) |
申请公布日期 |
2016.01.27 |
申请号 |
EP20090808902 |
申请日期 |
2009.08.21 |
申请人 |
S3C, INC. |
发明人 |
DANGTRAN, JOHN;HORTON, ROGER |
分类号 |
G01L9/06;B81B7/00 |
主分类号 |
G01L9/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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