| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin precursor composition which has a high glass transition temperature and a low coefficient of thermal expansion, suppresses warpage of a printed wiring board in a comprehensive manner when used in the printed wiring board, meets the demand for further thinning of a printed wiring board, and ensures superior reliability such as insulation reliability when applied to a thin printed wiring board. <P>SOLUTION: The epoxy resin precursor composition comprises a mixture of specific epoxy compounds described in the specification, a bismaleimide compound, an inorganic filler, and a basic organic solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
