| 摘要 |
Mounting a power supply ring-shaped conductor and a ground ring-shaped conductor within the innermost circumferential ring-shaped area enclosing the semiconductor chip and within the ring-shaped region adjacent to the outer side of this innermost circumferential ring-shaped region when mounting the semiconductor chip on the substrate package, makes the chip more resistant to noise but also conversely causes the problem of increased cost and size for the entire semiconductor device. The power supply pad and ground pad are here clustered in the outermost ring-shaped area on the semiconductor chip. The power supply terminal and ground terminal are clustered on the innermost ring-shaped region enclosing the semiconductor chip. This placement reduces the size and manufacturing cost of the overall semiconductor device. |
